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Micromechanical System For System-On-Chip Connectivity

Micromechanical systems can be combined with microelectronics, photonics or wireless capabilities new generation of Microsystems can be developed which will offer far reaching efficiency regarding space, accuracy, precision and so forth. Micromechanical systems (MEMS) technology can be used fabricate both application specific devices and the associated micro packaging systems that will allow for the integration of devices or circuits, made with non-compatible technologies, with a System-on-Chip environment. The MEMS technology can be used for permanent, semi permanent or temporary interconnection of sub modules in a System-on-Chip implementation. The interconnection of devices using MEMS technology is described with the help of a hearing instrument application and related micropackaging.
                MEMS technology offers wide range application in fields like biomedical, aerodynamics, thermodynamics and telecommunication and so forth. MEMS technology can be used to fabricate both application specific devices and the associated micropackaging system that will allow for the integration of devices or circuits, made with non compatible technologies, with a SoC environment .

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